Besi die Bonder：Die Bonding
Die Bonding
Datacon 2200 evo
https://www.besi.com
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Die Attach
https://www.besi.com
Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft ...
Esec 2100 FC hS
https://www.besi.com
The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC ...
Esec 2100 hS
https://www.besi.com
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Flip Chip
https://www.besi.com
Flip Chip. Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.
Soft Solder Die Bonding
https://www.besi.com
Besi Switzerland is a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market. Its ...