Wafer scribe line
「Wafer scribe line」熱門搜尋資訊
「Wafer scribe line」文章包含有：「Impactofscribeline(kerf)defectivityonwaferyield」、「Teststructuresaredeployedinwaferscribelinesto...」、「Theback」、「US20140077320A1」、「US8952497B2」、「WaferscribelinestructureforimprovingICreliability」、「切割道結構及切割晶圓之方法」、「微影製程切割道縮減之研究」、「解決方案」
查看更多
Impact of scribe line (kerf) defectivity on wafer yield
https://ieeexplore.ieee.org
The scribe line, with intermittent regions of low and high pattern density, is naturally more prone to dishing, an issue which is exacerbated by thickness ...
Test structures are deployed in wafer scribe lines to ...
https://www.researchgate.net
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and ...
The back
https://sst.semiconductor-dige
To break the wafer, a scribe line must be created in the wafer surface along the streets where the break is desired. This line creates a stress concentration ...
US20140077320A1
https://patents.google.com
A wafer includes a plurality of chips arranged as rows and columns. A first plurality of scribe lines is between the rows of the plurality of chips.
US8952497B2
https://patents.google.com
A wafer includes a plurality of chips arranged as rows and columns. A first plurality of scribe lines is between the rows of the plurality of chips.
Wafer scribe line structure for improving IC reliability
https://patents.google.com
The scribing is carried out on the active side of the semiconductor wafers where the integrated circuits and the multi-layer wiring layers of the IC devices are ...
切割道結構及切割晶圓之方法
https://patentimages.storage.g
A scribe line structure is disclosed. The scribe line structure preferably includes a semiconductor substrate having a die region, a die seal ring region, ...
微影製程切割道縮減之研究
https://ir.nctu.edu.tw
... wafer size and line width reduction. In terms of photolithography process, the composition of the chip area also contains scribe lines, and its main usage ...
解決方案
https://www.yuanyu.tw
Wafer Scribe line Observation Measurement. 晶圓切割預留寬度越大，晶圓上可放置的元件越少，成本相對上升，因此晶圓切割成為半導體產業製程中關鍵因素之一。OLS5000 ...