aspect ratio半導體：高深寬比玻璃基板電鍍填孔及檢測技術

A Sense of Scale

https://newsroom.lamresearch.c

Already tall and narrow – or high aspect ratio (HAR) – chip structures are stretching to even more exaggerated shapes as additional device components are “ ...

Aspect Ratio

https://www.sciencedirect.com

The aspect ratio is a key factor for ELOG growth. A high aspect ratio is desired for dislocation density reduction and device fabrication. The dependence of the ...

CN1423310A

https://patents.google.com

在半导体制程中，沟槽宽度与其深度的比值(H/W)通常可称的为深宽比(Aspect Ratio；AR)。当深宽比增加时，即表示沟槽深度的增加或是沟槽宽度的减少，此造成沟槽蚀刻的 ...

Fabrication of high aspect ratio, non-line

https://www.nature.com

DRIE is the most common technique used with 3D integration and provides a maximum aspect ratio of 10–30. The aspect ratios of vias created using ...

High Aspect Ratio structures in semiconductor chips

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〈工業技術與資訊〉高深寬比玻璃基板電鍍填孔及檢測技術

https://news.cnyes.com

中介層需要內接金屬導線作為上下訊號傳遞的通道，因此會針對玻璃進行穿孔加工，隨著半導體製程的不斷演進，導線孔洞的「深寬比」（Aspect Ratio；AR）持續 ...

半導體之重組層材料技術

https://www.materialsnet.com.t

PSPI其線路深寬比(Aspect Ratio)可調，例如在L/S為5 μm/5 μm，其線路深寬比可調整至2:1；L/S為2 μm/2 μm時，其Aspect Ratio為1.5，如圖一所示。PSPI ...

半導體往三維製程的路徑

https://www.digitimes.com.tw

由於在蝕刻技術上解決了高寬高比(high aspect ratio)的問題，讓3D結構中深邃的溝槽(trench)和孔洞(hole)得以順利形成。這個堆疊層數的未來長成空間可 ...