Copper whisker:Whisker Formation in Copper Electroplating
Whisker Formation in Copper Electroplating
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由THan著作·2011—Inthispaper,wedocumentfactorsthatcanaffectthegrowthofCuwhiskers;decompositionofadditivesintheCuelectroplatingsolution, ...。其他文章還包含有:「AStudyofWhiskerFormationintheElectrodeposition...」、「CopperWhiskerGrowthfrominsideSulfur」、「CuwhiskerECSabstracts」、「Growthmechanismofcopperwhiskersbythehydrogen...」、「PartAWhiskerFormationonTinPlatedCubased...」、「Whisker(meta...
查看更多 離開網站![A Study of Whisker Formation in the Electrodeposition ...](https://i0.wp.com/api.multiavatar.com/A+Study+of+Whisker+Formation+in+the+Electrodeposition+....png?apikey=viVnb6N20jclO8)
A Study of Whisker Formation in the Electrodeposition ...
https://iopscience.iop.org
Under certain conditions the electrolysis of acid copper sulfate between copper electrodes leads to formation of long filaments, or whiskers, of copper on the ...
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Copper Whisker Growth from inside Sulfur
https://www.sciencedirect.com
We report on the growth of Cu whiskers (10 μm in linear transverse size) at the surface of a YBCO pellet, in a sulfur-rich atmosphere at a high synthesis ...
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Cu whisker ECS abstracts
https://www.electrochem.org
Classical whiskers are usually single crystal, straight with sharp tips, while fibrous copper deposits were polycrystalline of. Cu(111) and (200) orientations.
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Growth mechanism of copper whiskers by the hydrogen ...
https://www.sciencedirect.com
Preferential condensation and reduction were found to occur at the whisker edges. Based on the observed facts, a growth mechanism is presented. Secondary ...
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Part A Whisker Formation on Tin Plated Cu based ...
https://www.nxp.com
Sn-plating on Cu-base-material is prone to whiskers. Ni-underlayer will eliminate whisker risk. Cu-based leadframe @ RT. Whisker on Cu.
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Whisker (metallurgy)
https://en.wikipedia.org
... copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders. Silver ...
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Whisker growth under various storage conditions on a Cu
https://www.researchgate.net
The characterization results obtained confirm that temperature cycling and isothermal storage favor the formation of whiskers on Sn-plated copper lead frames.
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Whiskers from Tin
https://nepp.nasa.gov
1. Spiral tin whisker and distorted tin whisker · 2. Irregular plate-like tin whisker and regular ribbon-like tin whisker · 3. Tin whiskers with ...