DISCO laser grooving：Stealth dicing
Stealth dicing
Low-k Grooving
https://www.disco.co.jp
Laser grooving process. First, the DFL7161 rapidly makes two laser grooves in the dicing street - either Pi Laser Grooving or Omega Laser Grooving; then the ...
Low-k膜開槽加工
https://www.disco.co.jp
利用採用該項加工製程，能夠提高生產效率，減少甚至解決因崩裂、分層（薄膜剝離）等不良因素造成的加工品質問題。 Pi (π)雷射開槽加工(階梯式切割刀片切割). Pi (π)雷射開 ...
Laser grooving kerf check function
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This function can be installed as a user-specified specification. DISCO offers various kerf check methods for various applications. For details, please contact ...
DFL7161
https://www.disco.co.jp
High-quality, high-throughput standard laser grooving model · DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. · It ...
Laser Dicing
https://www.disco.co.jp
The low-K grooving process removes the wiring layer, including the low-K film, using laser grooving equipment. Solutions · Blade Dicing · Laser Dicing.
Low
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Ablation process
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The ablation provides three types of processes - grooving, full cut, and scribing - by adjusting the laser depth. Grooving ・Process that removes the fine ...
Disco
https://www.aurotech.com
High-quality, high-throughput standard laser grooving model. Φ300 mm. Ablation. DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already ...