Edgebond：EDGE BOND
EDGE BOND
台灣製造商
https://www.ezbond.com.tw
晶片邊膠粘結劑(Edgebond) ，有時也被稱為角落點膠劑(Cornerbond) ，是板級底部填充膠的絕佳替代品。 消除電路板預熱和毛細流動現象，降低工藝成本。因為空隙和與助焊劑殘留物 ...
Zymet晶片邊膠粘結劑
https://www.touchtaiwan.com
晶片邊膠粘結劑(Edgebond) ，有時也被稱為角落點膠劑(Cornerbond) ，是板級底部填充膠的絕佳替代品。 消除電路板預熱和毛細流動現象，降低工藝成本。因為空隙和與助 ...
ALPHA® HiTech Edgebond
https://www.macdermidalpha.com
ALPHA HiTech Edgebond is a one component, heat curable epoxy that is dispensed on the corners of the BGA. The cured Edgebond will help to strengthen the ...
关于Edgebond Adhesive的应用
http://www.g4e.cn
“晶片边胶粘结剂(Edgebond) 通常使用於只需将BGA/CSP晶片边缘固定即可达到接著的目的，它不像底部填充剂（Underfill）必须完全渗透到覆晶晶片底部才可达到 ...
Edgebond(Corner Bond Adhesive)
https://www.ezbond.com.tw
Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is ...
Edgebond
https://www.kester.com
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA.
Reworkable Edgebond Adhesives
https://zymet.com
Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is ...