3Dblox standard：台積電宣布推出全新3Dblox 2.0 標準，展示3DFabric 聯盟成果
台積電宣布推出全新3Dblox 2.0 標準，展示3DFabric 聯盟成果
2023年9月28日—台積電指出，3Dblox開放標準於2022年推出，旨在為半導體產業簡化3DIC設計解決方案，並將其模組化。在規模最大的生態系統的支援下，3Dblox已成為未來3DIC ...。其他文章還包含有：「3DbloxStandardOrganization」、「TSMCAnnouncesBreakthroughSettoRedefinetheFuture...」、「Cadence以全新系統原型流程擴大支援台積電3Dblox2.0標準」、「TSMCIntroducestheNewestAdditiontoOIP」、「CadenceExpandsSupportfor3D...
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3Dblox Standard Organization
https://3dblox.org
3Dblox Standard aims to modularize and streamline the 3DIC package solutions that are available in the semiconductor industry.
TSMC Announces Breakthrough Set to Redefine the Future ...
https://pr.tsmc.com
Introduced last year, the 3Dblox open standard aims to modularize and streamline 3D IC design solutions for the semiconductor industry. With ...
Cadence 以全新系統原型流程擴大支援台積電3Dblox 2.0 標準
https://www.cadence.com
Integrity 3D-IC 平台完全符合3Dblox 2.0 標準語言擴展，並且流程已針對台積電的所有最新3DFabric產品進行了優化，包括集成扇出(InFO)、基板上晶圓上晶片( ...
TSMC Introduces the Newest Addition to OIP
https://www.tsmc.com
The modularized TSMC 3Dblox™ standard is designed to model, in one format, the key physical stacking and the logical connectivity information in ...
Cadence Expands Support for 3Dblox 2.0 Standard with ...
https://www.cadence.com
The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity ...
TSMC 3Dblox™
https://www.youtube.com
TSMC unveils 3Dblox 2.0 open standard
https://electronics360.globals
The overall goal of the 3Dblox open standards is to advance 3D IC design in the semiconductor industry and TSMC is working with an ecosystem of ...