Datacon besi：Datacon
Datacon
Besi
https://www.cti-rep.com
BESI-DATACON VIDEOS ; 2200 EVO Product Introduction. Parallel Processing ; Eutectic Bonding. Silver Sinter Process ; Flip Chip Die Bonding. Integrated Dispense ...
Besi
https://www.besi.com
BE Semiconductor Industries NV (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications.
Datacon 2200 evo
https://www.besi.com
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Datacon 2200 evo advanced
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Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements.
Datacon 2200 evo hF
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The Datacon 2200 evo hF sets new benchmarks in its class, with an increased bond force of up to 500N and outstanding machine accuracy of ±10 µm @ 3s. The ...
Datacon 2200 evo hS
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The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for ...
Datacon 2200 evo plus
https://www.besi.com
This evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm.
Datacon 8800 FC QUANTUM advanced
https://www.besi.com
The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective ...