Die Attach Film:DBG + DAF雷射切割
DBG + DAF雷射切割
DAF for Die to Die<BR>AFN303
https://www.jipal.com
Key Features. AFN303 is Thin Thickness Die attach Film Designed for use in Die to Die; DAF Thickness is 10um; AFN303 has Higher Adhesion Property to Chip.
DDS2300 | 晶粒擴片機
https://www.disco.co.jp
提升黏貼於DAF上薄晶圓的分割品質 · 對DBG製程後的DAF切割也有效 · 實現隱形切割TM加工後穩定的晶粒分割 · 透過冷擴片提升DAF分割品質 · 透過鐵圈(Tape Frame)搬送,可更順暢地 ...
Dicing Die Attach Film
https://www.furukawa.co.jp
Die Attach Film is adhesive film which is used for semiconductor process. It is combined with dicing tape, and it is called as Dicing Die Attach Film.
Die Attach Film(DAF
https://www.niching.com.tw
Die Attach Film(DAF,FOD,FOW) 晶圓黏結薄膜. 產品特色. 可配合UV型或非UV型切割膠布優良的作業性, 無晶片頂取問題改善熱機械特性快速烘烤(130°C烘烤1小時)
何謂DAF(Die Attach Film)? 晶圓切割膠帶(Dicing tape)?
http://www.film-top1.com
DAF (Die Attach Film)為晶片黏結薄膜,用途是在雷射切割時,晶片可一起切割與分離,進行剝離(擴膜),使切割完後的晶片,都還可黏著在薄膜上,不會因切割而造成散亂排列。
固晶膜
https://www.waferchem.com.tw
Die Attach Film (DAF) 固晶膜. DAFF.JPG. 優點: ○台灣自主研發,在地生產. ○良好的介面接著力. ○膜材使用上操作性優於固晶膠. ○附著性佳. ○耐化學藥劑特性佳.
晶片接著劑
https://www.henkel-adhesives.c
使用LOCTITE® ABLESTIK導電晶片接著膜(CDAF),支架(Leadframe)封裝製造商可以採用與非導電晶片接著劑工藝相同的工藝優勢:可控爬膠、可控膠層、避免晶片傾斜以及通過避免 ...