Furukawa Tape:For protectiontransfer processes UV tape
For protectiontransfer processes UV tape
Dicing Die Attach Film
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Furukawa Electric products are suited to a variety of applications. We will introduce much suitable tape to your process, Just inform us device/application and ...
Furukawa Electric
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Furukawa Electric. 首頁 · 產品服務 · 半導體 · Furukawa Electric · Non-UV Tape for Bumped Wafer Back Grinding<BR>CP9206M-430.
Products
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Tape for Backgrinding. These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
Tape for Backgrinding
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This is protection tape for circuit of semiconductor wafer surface in back grinding process. Feature. Suitable for thin wafer grinding caused by stress ...
Tape for Dicing|About us
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This tape is used to hold semiconductor wafer during dicing/singulation process. Feature. Strong Adhesion before UV Irradiation. Easy Peel-off after UV ...
Tape for Semiconductor Process
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We are supporting front line of semiconductor industry with Advanced Tape and Advanced Film Technology. Read more · Tape for Backgrinding. Tape for Dicing.
Tape for Semiconductor Process
https://www.furukawa.co.jp
Tape for Backgrinding. These tapes are designed for surface protection of semiconductor wafers during backgrinding process. See more. Tape for Dicing.
Technology
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Our back-grinding tape for SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.