ESEC:Esec 2100 hS ix - Die Bonding

Esec 2100 hS ix - Die Bonding

Esec 2100 hS ix - Die Bonding

TheEsec2100hSixisthelatestmemberofthe2100iDieBonderfamily.Itisoptimizedforhighestspeedandscratch-freetransportthankstothe ...。其他文章還包含有:「ESEC」、「Esec2009SSIE」、「Esec2100FChS」、「Esec2100hS」、「Esec2100hSi-DieBonding」、「Esec2100SC」、「Esec2100sDadvancedi-DieBonding」

查看更多 離開網站

TheEsec2100hSixisthelatestmemberofthe2100iDieBonderfamily.Itisoptimizedforhighestspeedandscratch-freetransportthankstotheeasy-to-usemotorizedandprogrammablerailstriphandler.TheEsec2100hSixalsoincorporatestheprovenfeaturesofthe2100igeneration,suchastheHighResolutionVisionSystemsandtheDualDispensingModule. TheEsec2100hSixisthenewgenerationHighSpeedDieBonderprovidingnowthebestCostofOwnership(CoO). MoreinformationSeeingisbelieving,sowearemorethanhappytogiveyouademonstrationonalivesystem.Contactu...

Provide From Google
ESEC
ESEC

https://www.jsecl.com

提供半導體耗材、設備、零件、精密加工、維修等服務,並代理國外各種品牌商品.

Provide From Google
Esec 2009 SSI E
Esec 2009 SSI E

https://www.besi.com

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are ...

Provide From Google
Esec 2100 FC hS
Esec 2100 FC hS

https://www.besi.com

Esec 2100 FC hS · Key Features · Highest Speed at 8 µm Accuracy · Leading Edge Machine Concept · Highest Up Time · Fastest time to Yield · The Platform of the Future.

Provide From Google
Esec 2100 hS
Esec 2100 hS

https://www.besi.com

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...

Provide From Google
Esec 2100 hS i - Die Bonding
Esec 2100 hS i - Die Bonding

https://www.besi.com

The new Esec 2100 hSi with its new Dual Dispensing Module enables an unmatched productivity and process quality. Process Accuracy is further improved with ...

Provide From Google
Esec 2100 SC
Esec 2100 SC

https://www.besi.com

The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run ...

Provide From Google
Esec 2100 sD advanced i - Die Bonding
Esec 2100 sD advanced i - Die Bonding

https://www.besi.com

The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT ...