High temperature dicing tape：Dicing and Grinding Tapes
Dicing and Grinding Tapes
AITistheonlymanufacturerofdicingtapesthatcanwithstandhightemperatureexposure.Thisuniqueabilitytotoleratehightemperaturesisfurtherenhanced ...。其他文章還包含有：「DicingTape」、「DicingTape」、「Heat」、「High」、「SemiconductorWaferProcessingTapeSWT10+R」、「ThermalReleaseTapeForce」、「UVCurableDicingTape」、「WaferDicingTapes」
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Dicing Tape
https://s3-alliance.com
HUV-D1000 Series, is a double-sided dicing tape with UV cured adhesive. ... We also offer: Heat-Resistant Dicing Tape; Thermal Release Tape; Polyimide Tape ...
Dicing Tape
http://eng.abbatape.com
Features: Extremely thin grinding capability. Eliminates warping and sagging by firmly supporting the wafer. Easily releases at any time with heat treatment.
Heat
http://www.npmt.com.tw
HUV-D7000 Series is double-sided dicing tape of speical PET base film with heat-resistant adhesives that can endure up to 190 C. There are two types of HUV- ...
High
https://www.caplinq.com
LINQTAPE™PIT2S-RL-Series Polyimide™ Tape provides an excellent balance of electrical, mechanical, thermal, and chemical properties over a wide ...
Semiconductor Wafer Processing Tape SWT 10+R
https://www.nitto.com
Nitto Semiconductor Wafer Tape SWT 10+R is designed for semiconductor dicing processes. This product consists of a blue transparent PVC film coated with a ...
Thermal Release Tape Force
https://www.forceone-am.com
Thermal Release Film(Dicing tape,Valfo Tape) can be released after heating the tape to a ... High temperature: 180-190 degrees, 3-5 minutes foam stripping.
UV Curable Dicing Tape
https://www.semicorp.com
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. SPECIFICATIONS. P/N 24216 UE-2091J Extra High ...
Wafer Dicing Tapes
https://www.aitechnology.com
Industry's unique high temperature dicing tape with both flexible substrate and adhesive to withstand temperature up to 250°C for post and pre-dicing ...