lintec d-175 datasheet:UV Curable Dicing Tape
UV Curable Dicing Tape
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DicingTapeDseries(UVCurableDicingTape)·1.Secureswaferswithstronginitialadhesiontoensuredicingwithoutanyslippingorpeelingevenforsmall ...。其他文章還包含有:「ADWILLkatalog2020」、「DSeries紫外線硬化型切割膠帶」、「DicingTapeLine」、「lintecD175datasheet&applicationnotes」、「TAIKO晶圓用切割膠帶」、「Technicaldatasheetdownload」、「UVCur」、「UVtapeD」
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ADWILL katalog 2020
https://www.linteceurope.com
Adwill is LINTEC's product series for semiconductor-related adhesive tapes and equipment. The Adwill portfolio includes. UV-curable dicing tapes, high.
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D Series 紫外線硬化型切割膠帶
https://www.lintec.com.tw
各製程之膠帶用途. Adwill D Series可因應作業製程而改變特性的劃時代紫外線硬化型切割膠帶(UV Curable Dicing Tape)。
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Dicing Tape Line
https://www.lintec.com.tw
Equipment used with Dicing Tape. 紫外線硬化型切割膠帶. 代表產品Primal Product Name. 用途Application. 特徵Feature. 基材Base Material. D-176D / D-175D*.
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lintec D175 datasheet & application notes
https://www.datasheetarchive.c
lintec D175 datasheet, cross reference, circuit and application notes in pdf format.
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TAIKO晶圓用切割膠帶
https://www.lintec.com.tw
產品名稱. D-171D. D-174D. D-175D*. D-485H ; 膠帶總厚度. 90μm. 90μm. 90μm. 85μm ; 黏著力( 紫外線照射前). 5000. 740. 580. 4900.
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Technical data sheet download
https://www.lintec-global.com
This is the Technical data sheet download of construction- and automobile-related products of LINTEC Corporation.
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UV Cur
https://lintec-usa.com
Reduced wafer warpage with programmable tape tension. □ Programmable cutting angles to reduce wafer damage and provide the cleanest possible cut.
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UV tape D
https://www.datasheetarchive.c