Underfill rework：Underfill(底部填充劑)的目的與操作程序

Underfill(底部填充劑)的目的與操作程序

2012年2月1日—...underfill之後的晶片就很難再對其進行修理(repair)或重工(rework)的動作。底部填充劑添加之後還需要再經過高溫烘烤以加速環氧樹脂的固化時間，另外 ...。其他文章還包含有：「(PDF)DevelopingaReworkProcessforUnderfilled...」、「BGAunderfill后如何rework?」、「UnderfillRework」、「UnderfillReworkServicesatBESTInc.」、「Underfill(底部填充劑)的目的與操作程序」、「UnderfilledSMD(rework&repairpro...

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(PDF) Developing a Rework Process for Underfilled ...

https://www.researchgate.net

PDF | This paper integrates the theory of inventive problem solving and cluster analysis to develop effective rework processes for underfilled.

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BGA underfill后如何rework?

http://bbs.smthome.net

我们公司现在用的underfill是乐泰的FF2200和FF2300，目前为止所有关于underfill的不良品全部报废。不知有哪位用过这两种胶水？用哪种除胶剂Rework比较好？

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Underfill Rework

https://docs.xilinx.com

The following steps detail the underfill rework process based on evaluation on a typical InFO package. This process is only possible with ...

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Underfill Rework Services at BEST Inc.

https://www.solder.net

The goal of this type of rework project is to remove the underfilled device replacing it with a good die. The removal of this material can be accomplished ...

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Underfill(底部填充劑)的目的與操作程序

https://www.researchmfg.com

底部填充劑的材料通常使用環氧樹脂(Epoxy)，它利用毛細作用原理將Epoxy塗抹在晶片的邊緣讓其自動滲透到覆晶晶片或BGA的底部，然後再加熱予以固化(cured)。

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Underfilled SMD (rework&repair process)

https://finetech.de

Underfill represents a very special challenge for the rework process, because in addition to thermal energy, mechanical energy must be applied in order to ...

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