non-wetting solder：電路板上常見的焊錫缺點中英文對照與解釋
電路板上常見的焊錫缺點中英文對照與解釋
2011年2月20日—Non-Wetting&De-Wetting解釋.另外，在IPC-A-610的定義裡面有兩個主要...De-wetting：Aconditionthatresultswhenmoltensoldercoastsa ...。其他文章還包含有：「AreyouexperiencingSMTNon」、「HowtoPreventNon」、「HowtoPreventNon」、「HowtoPreventNon」、「PCBAssembly」、「PCBNonwetting」、「SMTNon」、「WhatiswettingSoldering」
查看更多 離開網站工作熊雖然在電子製造業打滾了許多年，但自知前輩還是很多，班門弄斧來分享自己知道的一些關於SMT焊錫性缺點的中英文對照，有需要的朋友可以參考一下。必須先聲明，有些名詞或單字可能在工作熊的公司內已經行之有年，所以大家也都認識且可以接受，但不一定就表示業界的所有人都如此稱呼！不過大體上應該都沒有太大問題才對。會有此感慨是因為常常看到台灣及大陸有些工程師英文真的爛得可以，常常工程師把不良的分析報告用中文寫好後交給懂英文的PM翻成英文，偏偏PM又不懂這些焊錫缺點的專有名詞，結果有些焊錫的專有名詞就被直接用翻...
Are you experiencing SMT Non
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Non-wetting can be defined by saying it has the inability of molten solder to form a metallic bond with the base metal.
How to Prevent Non
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According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal. This results in the PCB ...
How to Prevent Non
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According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal. This ...
How to Prevent Non
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A non-wetting defect occurs when molten solder fails to bond with the base metal on the board. Read our article to learn how to prevent soldering defects!
PCB Assembly
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A non-wetting defect is a soldering defect that occurs when molten solder fails to bond with the base metal on the board. When this bond fails ...
PCB Nonwetting
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Printed Circuit Board Nonwetting is a condition whereby a surface has contacted molten solder but has had part or none of the solder adhere to it. PCB ...
SMT Non
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SMT Non-Wetting Issue. Non-wetting can be defined by saying it has the inability of molten solder to form a metallic bond with the base metal.
What is wetting Soldering
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Non-wetting defects are a type of soldering issue that happens when the solder does not fit to make the bond with a PCB metal alloy. However, when the inability ...