Backside IR inspection:Backside Inspection
Backside Inspection
Inspectionofthewafer'sbacksidehasbecomevaluable,assuringwafershavenotbecomecontaminatedwithparticlesordamaged,whicheventuallyresultsin ...。其他文章還包含有:「Flip」、「IC故障分析的常用工具介紹」、「Infrared(IR)Inspection」、「InfraredImaging」、「SiliconInspection」、「Waferinternaldefectinspectionsystem"INSPECTRA®IR"...」、「晶圓紅外線檢查機」、「高可靠度型、紅外線穿透型)」
查看更多 離開網站Flip
https://www.osti.gov
PEM Inspection from Backside: Key Issues. Key issues: •Absorption of the Si ... IR LIVA Backside Example: Open Metal to Silicon Contact. Backside IR LIVA ...
IC故障分析的常用工具介紹
https://www.materialsnet.com.t
EMMI則是可以做背面式(back side) 光子偵測,其必須增加. Cooled-CCD Camera及IR光源。整. 個系統的示意圖如圖一。 EMMI主要偵測IC內部所放出的光. 子,故障處或非故障處 ...
Infrared (IR) Inspection
https://www.tztek.com
Infrared (IR) Inspection. Silicon, GaAs wafers and other substrates become ... Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers.
Infrared Imaging
https://www.semitracks.com
Aside from sample preparation, IR backside imaging is almost as easy to do as frontside optical examination, with the exception that the human eye cannot ...
Silicon Inspection
https://www.swirvisionsystems.
Frontside or backside illumination of the silicon-based devices with infrared lighting enables imaging of wafer alignment marks, particles, micro-cracks ...
Wafer internal defect inspection system "INSPECTRA® IR" ...
https://www.toray-eng.com
Void inspection in bonded wafers; Defect inspection in high aspect ratio trenches; Backside crack inspection in High-density wafer. Specifications (IR). Pixel ...
晶圓紅外線檢查機
https://www.yayatech.com
... (Back side chipping)等難題。而背面崩裂,或晶片內層崩裂因無法用肉眼判斷,稱之為 ... Auto IR Inspection. Copyright © YAYATECH Co. Ltd. All Rights Reservd. Design ...
高可靠度型、紅外線穿透型)
https://www.lintec.com.tw
Wafer Backside Inspection by IR Camera (Top View). IR transmission type. 可穿透膠帶. 紅外線穿透型. 一般產品. General LC Tape. ※晶片尺寸:1 mm x 1 mm. Die size : ...