Backside IR inspection:Backside Inspection

Backside Inspection

Backside Inspection

Inspectionofthewafer'sbacksidehasbecomevaluable,assuringwafershavenotbecomecontaminatedwithparticlesordamaged,whicheventuallyresultsin ...。其他文章還包含有:「Flip」、「IC故障分析的常用工具介紹」、「Infrared(IR)Inspection」、「InfraredImaging」、「SiliconInspection」、「Waferinternaldefectinspectionsystem"INSPECTRA®IR"...」、「晶圓紅外線檢查機」、「高可靠度型、紅外線穿透型)」

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Flip
Flip

https://www.osti.gov

PEM Inspection from Backside: Key Issues. Key issues: •Absorption of the Si ... IR LIVA Backside Example: Open Metal to Silicon Contact. Backside IR LIVA ...

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IC故障分析的常用工具介紹
IC故障分析的常用工具介紹

https://www.materialsnet.com.t

EMMI則是可以做背面式(back side) 光子偵測,其必須增加. Cooled-CCD Camera及IR光源。整. 個系統的示意圖如圖一。 EMMI主要偵測IC內部所放出的光. 子,故障處或非故障處 ...

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Infrared (IR) Inspection
Infrared (IR) Inspection

https://www.tztek.com

Infrared (IR) Inspection. Silicon, GaAs wafers and other substrates become ... Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers.

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Infrared Imaging
Infrared Imaging

https://www.semitracks.com

Aside from sample preparation, IR backside imaging is almost as easy to do as frontside optical examination, with the exception that the human eye cannot ...

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Silicon Inspection
Silicon Inspection

https://www.swirvisionsystems.

Frontside or backside illumination of the silicon-based devices with infrared lighting enables imaging of wafer alignment marks, particles, micro-cracks ...

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Wafer internal defect inspection system "INSPECTRA® IR" ...
Wafer internal defect inspection system "INSPECTRA® IR" ...

https://www.toray-eng.com

Void inspection in bonded wafers; Defect inspection in high aspect ratio trenches; Backside crack inspection in High-density wafer. Specifications (IR). Pixel ...

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晶圓紅外線檢查機
晶圓紅外線檢查機

https://www.yayatech.com

... (Back side chipping)等難題。而背面崩裂,或晶片內層崩裂因無法用肉眼判斷,稱之為 ... Auto IR Inspection. Copyright © YAYATECH Co. Ltd. All Rights Reservd. Design ...

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高可靠度型、紅外線穿透型)
高可靠度型、紅外線穿透型)

https://www.lintec.com.tw

Wafer Backside Inspection by IR Camera (Top View). IR transmission type. 可穿透膠帶. 紅外線穿透型. 一般產品. General LC Tape. ※晶片尺寸:1 mm x 1 mm. Die size : ...