ASM Die bonder：NANO
NANO
AFC Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
ASM AD8930 Die Bonder 固晶機上片機
https://www.jsecl.com
ASM AD8930 Die Bond, Chip mounter, 固晶機,上片機, 黏晶機, 4 sets available, Vintage:2007.
ASM Die Bonder and Flip Chip Bonder
http://en.bestsoon-china.com
AFC Plus ASM Die Bonder and Flip Chip Bonder. Feature. ○The precision of die die and poly die machine is ±1µm @ 3S. ○Die die cycle <15 seconds.
ASMPT AMICRA
https://amicra.semi.asmpt.com
Our equipment offering supports: Die Attach and Flip Chip Bonding; High Speed Dispense System and Custom Solutions. Our market focus includes: Opto, Silicon ...
CoS Die Bonder: High-precision chip
https://www.asmpt.com
ASM AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
Die Bonding
https://semi.asmpt.com
Automatic High Precision Die Bonder. Automatic Eutectic Die Bonder with Heated Collet Bond Head. Multichip Die Bonder. Automatic Die Bonder. Photon Pro.
Nova Plus
https://amicra.semi.asmpt.com
high precision die bonder / flip chip bonder; accuracy +/- 1.0 µm @ 3s; a cycle- time of < 3 sec; modular machine concept for all micro assembly applications ...