Azurewave wifi Module
「Azurewave wifi Module」熱門搜尋資訊
「Azurewave wifi Module」文章包含有：「AW-CM358MA」、「azurewave-電腦電子」、「AzurewaveAW」、「AzureWaveComboWirelessModules」、「AzureWaveIoTConnectivityModule」、「AzureWaveWi」、「InfineonWirelessModule」、「NXPWirelessModule」、「Wi」、「WirelessModules」
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AW-CM358MA
https://www.nxp.com
The AW-CM358MA is a highly integrated NXP 88W8987 chipset-based WLAN and Bluetooth module, which support 802.11a/b/g/n/ac 1x1 and Bluetooth 5 combo module.
azurewave - 電腦電子
https://www.ruten.com.tw
AzureWave AW-GA800T USB 2.0 wireless module IEEE 802.11b/g. 100.
Azurewave AW
https://www.amazon.com
Azurewave AW-AH397 Dual Band WiFi+BT USB/SDIO SiP Module Marvell 8797 / Bluetooth 4.0+HS (LE) / 2T x 2R MIMO ;.57 ; 免費送貨 ;。詳細資訊 ; 數量：1 ; 出貨地點.
AzureWave Combo Wireless Modules
https://www.arrow.com
Arrow.com is an authorized distributor of AzureWave, stocking a wide selection of electronic components and supporting hundreds of reference designs.
AzureWave IoT Connectivity Module
https://www.azurewave.com
AzureWave IoT Connectivity Module · The AzureWave IoT Connectivity Module (AICM) is a Wi-Fi module with FreeRTOS qualified MCU that uses AT commands to securely ...
AzureWave Wi
https://www.infineon.com
AzureWave Wi-Fi + Bluetooth combo modules integrating. Infineon chipsets www.infineon.com. Wi-Fi modules. Page 2. AzureWave Wi-Fi + Bluetooth combo modules ...
Infineon Wireless Module
https://www.azurewave.com
Wireless Modules » · NXP Solution · Infineon Solution · MediaTeK AIoT Connectivity ... Infineon Wireless Module. Product Brief. 802.11n 1x1. AW-NM288SM. CYW43362.
NXP Wireless Module
https://www.azurewave.com
Wireless Modules » · NXP Solution · Infineon Solution · MediaTeK AIoT Connectivity ... NXP Wireless Module. Product Brief. 802.11n 1x1. AW-NM191NF. 88W8801.
Wi
https://www.azurewave.com
MediaTek Wireless Module. Wi-Fi Module for MediaTek AIoT Platform. Wi-Fi 5 2T2R (for MediaTek Genio 350, Genio 500 and Genio 510 platforms). AW-CB451NF. MT7663.
Wireless Modules
https://www.azurewave.com
A number of IC and passive components bundled inside a single package, like a standalone chip, used for mobile or wearable devices.