M705-ULT369

「M705-ULT369」熱門搜尋資訊

「M705-ULT369」文章包含有：「M705」、「ULT369Series|Solderpaste|Lead」、「千住M705锡膏」、「SolderPasteULT369」、「M705-ULT369TechnicalData-1.0E」、「SENJUECOSOLDERULT369SERIESSOLDERPASTE」、「锡膏-M705」、「type5無鉛錫膏」、「QNF爬锡困难，客户要求100%上锡，求助各位大神」

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M705

https://www.eurocircuits.com

ULT369 has a high flowability. Voids are easily discharged from solder. Even in case of subdivided pattern, ULT369 is able to decrease the voiding.

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ULT369 Series | Solder paste | Lead

https://www.senju.com

ULT369 Series ECO SOLDER PASTE. Recommended alloy(s) · M705. ULT369. Updated universal solder paste. Features. Improved printability and wettability. Suppresses ...

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千住M705锡膏

http://www.sz-etong.com

千住M705锡膏ULT369,追求通用性的焊锡膏,这是根据目前的表面实装发展趋势而设计的产品。另外，为了操作的“易用性”，从头开始重新审视每一道工序，对产品进行了优化。

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Solder Paste ULT369

https://www.senju.com

Improved liquidity of flux during solder melting for reducing voids. Lead-Free. ECO SOLDER PASTE. M705-ULT369. Sg/Cu. Manut Date: 2017.01.18.

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M705-ULT369 Technical Data - 1.0E

https://www.scribd.com

This technical report summarizes test results for Senju Metal Industry's M705-ULT369 solder paste. [1] ULT369 has excellent printability and flowability ...

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SENJU ECOSOLDER ULT369 SERIES SOLDER PASTE

https://www.solderconnection.c

– Available in lead-free alloy M705 (SAC305). Recommended Applications: – Ultra-Fine pitch printing. – Potential voiding issues on QFN Devices. – Reducing ...

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