NiPdAu
「NiPdAu」熱門搜尋資訊
「NiPdAu」文章包含有：「"EvaluationofNickelPalladiumGold」、「ANickel」、「Leadfinishcomposition&tinplatingprocess」、「MOSFET正面金屬化製程(FSM)的兩種選擇」、「MOSFET正面金屬化製程比一比：濺鍍vs.化鍍」、「NiPdAuandNiAuQFNPlatingThickness」、「NIPDAUvsSNfinishingandcertification」、「Shelf」、「包裝標籤上的“e”代碼」、「鎳鈀金PPF釘架銲線製程的研究」
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"Evaluation of NickelPalladiumGold
https://www.ti.com
Visual inspection of solder joints made with NiPdAu-finished leads all gave acceptable wetting performance, based on industry-standard criteria. Cross-sections ...
A Nickel
https://www.ti.com
The NiPdAu leadframe finished components investigated for this applicaton report showed no measurable Au embrittlement of the solder joint. Contents.
Lead finish composition & tin plating process
https://www.ti.com
Lead finish composition ; Standard, 85% SN, 15% Pb ; Standard · 63% SN, 37% Pb (some Metal Can packages) ; Pb-Free, Matte Sn ; Pb-Free · NiPdAu.
MOSFET正面金屬化製程(FSM)的兩種選擇
https://www.istgroup.com
UBM的組成金屬元素，在濺鍍和化鍍上各有不同，濺鍍使用鈦/鎳釩/銀(Ti/NiV/Ag)；化鍍則是使用鎳金/鎳鈀金(NiAu/NiPdAu)。 二、為什麼不是所有晶片都需 ...
MOSFET正面金屬化製程比一比：濺鍍vs.化鍍
https://www.eettaiwan.com
UBM的組成金屬元素，在濺鍍和化鍍上各有不同，濺鍍使用鈦/鎳釩/銀(Ti/NiV/Ag)，化鍍則是使用鎳金/鎳鈀金(NiAu/NiPdAu)。本文將完整描述正面金屬化的 ...
NiPdAu and NiAu QFN Plating Thickness
http://www.mirrorsemi.com
Check chart below for available plating thicknesses. About G1 (NiPdAu) plating thickness for ceramic package: G1 : Rich Gold plating. Excellent wire bondability ...
NIPDAU vs SN finishing and certification
https://electronics.stackexcha
The only difference is the quality in production yields and long term aging of Pb-free solder finishes to avoid defects.
Shelf
https://www.ti.com
The shelf life of integrated circuits with NiPdAu, NiPd, NiPdAu-Ag, matte Sn, and SnPb-finished leads is >8 years, as measured by solderability after ...
包裝標籤上的“e”代碼
https://forum.digikey.com
e4——貴金屬（例如銀（Ag）、金（Au）、鎳-鈀（NiPd）、鎳-鈀-金（NiPdAu）（不含錫（Sn））; e5——錫-鋅（SnZn）、錫-鋅-其他（SnZnX）（所有其他含錫 ...
鎳鈀金PPF釘架銲線製程的研究
https://ndltd.ncl.edu.tw
... NiPdAu PPF leadframe. Through Taguchi methods and analysis of variance are used to evaluate related matters that influence crescent bonding bondability ...