lintec s-75c:晶圓撕膜膠帶for Wafer De
晶圓撕膜膠帶for Wafer De
Provide From Google
![Peeling Tape for BG Tape](https://i0.wp.com/api.multiavatar.com/Peeling+Tape+for+BG+Tape+-+LINTEC+Corporation+-+Adwill.png?apikey=viVnb6N20jclO8)
Peeling Tape for BG Tape
https://www.adwill-global.com
A special-purpose tape for removing back grinding tape with the Wafer Mounter RAD-2500 series and the BG Tape Remover RAD-3000 series.
Provide From Google
![Pressure](https://i0.wp.com/api.multiavatar.com/Pressure-sensitive+adhesive+tape+and+production+method+....png?apikey=viVnb6N20jclO8)
Pressure
https://patents.google.com
Next, a polypropylene film (manufactured by Lintec, Adwill S-75C) having a width of 50 mm and a length of 60 mm was prepared as a peeling tape.
Provide From Google
![S Series 研磨用保護膠帶剝離用膠帶](https://i0.wp.com/api.multiavatar.com/S+Series+%E7%A0%94%E7%A3%A8%E7%94%A8%E4%BF%9D%E8%AD%B7%E8%86%A0%E5%B8%B6%E5%89%9D%E9%9B%A2%E7%94%A8%E8%86%A0%E5%B8%B6.png?apikey=viVnb6N20jclO8)
S Series 研磨用保護膠帶剝離用膠帶
https://www.lintec.com.tw
使用晶圓貼合機「RAD-2500系列晶圓貼合機」及「RAD-3000系列研磨用膠帶撕片機」進行表面保護膠帶剝除用的專用膠帶。 · 可與各種機台進行組合,能不損傷晶圓表面並能剝除表面 ...