lintec s-75c:Pressure
Pressure
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Peeling Tape for BG Tape
https://www.adwill-global.com
A special-purpose tape for removing back grinding tape with the Wafer Mounter RAD-2500 series and the BG Tape Remover RAD-3000 series.
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S Series 研磨用保護膠帶剝離用膠帶
https://www.lintec.com.tw
使用晶圓貼合機「RAD-2500系列晶圓貼合機」及「RAD-3000系列研磨用膠帶撕片機」進行表面保護膠帶剝除用的專用膠帶。 · 可與各種機台進行組合,能不損傷晶圓表面並能剝除表面 ...
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晶圓撕膜膠帶for Wafer De
https://tape-data.com
基材:PET. 膠系:亞克力特殊膠. 厚度:0.07(mm). 顏色:透明. 豐富*長度: 根據客戶需求. 側著力:2.0↑ (g/25mm). 晶圓研磨後藍膜撕除. 已有多家封裝廠實績.