ASM Flip Chip Bonder：ASM NANO PCB SMT Machine Die Bonder And Flip Chip ...
ASM NANO PCB SMT Machine Die Bonder And Flip Chip ...
NANOisanultra-precisiondieandflip-chipbonderforhighlydemandingassemblytasksbilledasthehighest-precisionplacementsysteminitsclass.Aimingat ...。其他文章還包含有：「NANO」、「AFCPlus」、「ASMAMICRAAFCPlusDieBonderFlipChipBonder」、「ASMPTDieBonderandFlipChip...」、「FlipChipBonding」、「NANODieBonderandFlipChipBonder」、「ASMAMICRAAFCplusDieBonderFlipChipBonder」、「'」
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NANO
https://amicra.semi.asmpt.com
NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at ...
AFC Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
ASM AMICRA AFC Plus Die Bonder Flip Chip Bonder
https://www.youtube.com
ASMPT Die Bonder and Flip Chip ...
http://en.bestsoon-china.com
AFC Plus ASMPT Die Bonder and Flip Chip Bonder. Feature. ○The precision of die die and poly die machine is ±1µm @ 3S.
Flip Chip Bonding
https://bitalux.eu
ASM Pacific Technology. Model AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling) Model NANO Die Bonder and Flip Chip Bonder
NANO Die Bonder and Flip Chip Bonder
https://bitalux.eu
Accuracy ± 0.3 µm @ 3s; Supports all die attach and flip chip applications; High precision alignment optics; Vibration damping system; Automatic placement ...
ASM AMICRA AFCplus Die Bonder Flip Chip Bonder
https://www.youtube.com
'
https://www.premtek.com.tw
Flip-Chip Bonder (Flipchip Bonder-A110). Flip-Chip Bonder (Flipchip Bonder-A110). High Accuracy with X-Y Gantry Structure, and high Productivity with Dual ...