AMICRA die bonder
「AMICRA die bonder」熱門搜尋資訊
「AMICRA die bonder」文章包含有：「AFCPlus」、「AMICRANano」、「ASMPTAMICRA」、「Company」、「CoSDieBonder:High-precisionchip」、「NANO」、「NovaPlus」、「Products」
查看更多
AFC Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
AMICRA Nano
http://www.schmidtek.com.tw
Accuracy: +/- 0.2μm@3S · Cycle time: 25~ 20 secs/ per die · Dimension Size: 1400mm x 1200mm x 1700mm · Machine Weight: 1800Kg.
ASMPT AMICRA
https://amicra.semi.asmpt.com
Die Attach and Flip Chip Bonding; High Speed Dispense System and Custom Solutions. Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, ...
Company
https://amicra.semi.asmpt.com
ASMPT AMICRA GmbH. More than Precision: Die Bonder / Flip Chip Bonder Systems - Dispense & Test Systems - Wafer Inking Solutions and more!
CoS Die Bonder: High-precision chip
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
NANO
https://amicra.semi.asmpt.com
NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at ...
Nova Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
Products
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...