AMICRA die bonder:AMICRA Nano
AMICRA Nano
AFC Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
ASMPT AMICRA
https://amicra.semi.asmpt.com
Die Attach and Flip Chip Bonding; High Speed Dispense System and Custom Solutions. Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, ...
Company
https://amicra.semi.asmpt.com
ASMPT AMICRA GmbH. More than Precision: Die Bonder / Flip Chip Bonder Systems - Dispense & Test Systems - Wafer Inking Solutions and more!
CoS Die Bonder: High-precision chip
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
NANO
https://amicra.semi.asmpt.com
NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at ...
Nova Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
Products
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...