AMICRA die bonder：NANO
NANO
AFC Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
AMICRA Nano
http://www.schmidtek.com.tw
Accuracy: +/- 0.2μm@3S · Cycle time: 25~ 20 secs/ per die · Dimension Size: 1400mm x 1200mm x 1700mm · Machine Weight: 1800Kg.
ASMPT AMICRA
https://amicra.semi.asmpt.com
Die Attach and Flip Chip Bonding; High Speed Dispense System and Custom Solutions. Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, ...
Company
https://amicra.semi.asmpt.com
ASMPT AMICRA GmbH. More than Precision: Die Bonder / Flip Chip Bonder Systems - Dispense & Test Systems - Wafer Inking Solutions and more!
CoS Die Bonder: High-precision chip
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
Nova Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
Products
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...