Datacon 2200 evo pdf：BE Semiconductor Industries N.V. 所有产品目录和PDF技术手册
BE Semiconductor Industries N.V. 所有产品目录和PDF技术手册
Datacon 2200 evo
https://www.besi.com
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Datacon 2200 evo advanced
https://www.besi.com
Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements.
Datacon 2200 EVO Dispense Pick and Place
https://www.bridgetronic.com
Configuration: Datacon 2200 EVO Dispense Pick and Place. - Die Handling System. - Upgrade Heated Bond Head. - Single Head Machine.
Datacon 2200 evo hF
https://www.besi.com
The Datacon 2200 evo hF sets new benchmarks in its class, with an increased bond force of up to 500N and outstanding machine accuracy of ±10 µm @ 3s. The ...
Datacon 2200 evo hS
https://pdf.directindustry.com
This evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a ...
Datacon 2200 evoadvanced 3µm
https://exhibitorsearch.messef
With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evoadvanced offers superb 3µm placement ...
Datacon 2200 evoplus
https://exhibitorsearch.messef
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term.