Datacon 2200 evo pdf：Datacon 2200 evo hS
Datacon 2200 evo hS
Thisevolutionarymachineoffershigheraccuracywithlong-termstabilityusinganewcamerasystemandthermalcompensationalgorithm,higherspeedthrougha ...。其他文章還包含有：「BESemiconductorIndustriesN.V.所有产品目录和PDF技术手册」、「Datacon2200evo」、「Datacon2200evoadvanced」、「Datacon2200EVODispensePickandPlace」、「Datacon2200evohF」、「Datacon2200evoadvanced3µm」、「Datacon2200evoplus」
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BE Semiconductor Industries N.V. 所有产品目录和PDF技术手册
https://pdf.directindustry-chi
Datacon 2200 evo hS. 2 页. Datacon 2200 evoplus. 2 页. Esec 2100 hS. 2 页. Fico ...
Datacon 2200 evo
https://www.besi.com
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Datacon 2200 evo advanced
https://www.besi.com
Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements.
Datacon 2200 EVO Dispense Pick and Place
https://www.bridgetronic.com
Configuration: Datacon 2200 EVO Dispense Pick and Place. - Die Handling System. - Upgrade Heated Bond Head. - Single Head Machine.
Datacon 2200 evo hF
https://www.besi.com
The Datacon 2200 evo hF sets new benchmarks in its class, with an increased bond force of up to 500N and outstanding machine accuracy of ±10 µm @ 3s. The ...
Datacon 2200 evoadvanced 3µm
https://exhibitorsearch.messef
With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evoadvanced offers superb 3µm placement ...
Datacon 2200 evoplus
https://exhibitorsearch.messef
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term.