DISCO Blade grit size:Dicing process using blades
Dicing process using blades
Dicing Thin Wafers
https://www.disco.co.jp
Grit size, feed speed, and spindle speed are closely interrelated processing factors that require knowledge and experience to adjust. DISCO performs careful ...
Disco NBC
https://www.equipx.net
DISCO's original blade development. These blades employ electroformed ... Grit size. #4500. #2000. #1200. #600. #320. Compound. Semiconductor Wafers. LiNbO3 ...
NBC-Z
https://www.disco.co.jp
Deep cutting and grooving are possible using ultra-thin blades. Blade thickness - 0.015 mm to 0.3 mm; Wide range of grit sizes and bond types are available to ...
NBC-ZH
https://www.aurotech.com
Wide range of grit sizes and bond types to support various application requirements; Easy to handle ultra-thin blades; Shorter blade change time for increased ...
ZH05 SERIES
http://www.dhk.co.kr
5 grit concentration levels support diverse applications. Higher blade strength reduces wavy cutting and blade breakage. The ZH05 Series offers shorter precut ...
ZH05
https://www.disco.co.jp
5 grit concentration levels support diverse applications. · The ZH05 Series offers shorter precut times and lower chance of blade breakage due to flying die.
ZHDG
https://www.disco.co.jp
Workpiece, Dresser board ; Depth, 0.5 mm (Half cut) ; Feed speed, 30 mm/s ; Spindle revolution, 30,000 min ; Grit size, #700 ...
ZHDG
https://www.disco.co.jp
Grit size, #700. 技術規格. 技術規格. ZHDG SERIESElectroformed Bond Hub Blades. 列印print. 安全使用說明 · 檢查表查詢 · FAQ. 聯繫我們. 如有任何問題,歡迎隨時聯繫 ...