DISCO Blade grit size：ZH05

ZH05

5gritconcentrationlevelssupportdiverseapplications.·TheZH05Seriesoffersshorterprecuttimesandlowerchanceofbladebreakageduetoflyingdie.。其他文章還包含有：「Dicingprocessusingblades」、「DicingThinWafers」、「DiscoNBC」、「NBC-Z」、「NBC-ZH」、「ZH05SERIES」、「ZHDG」、「ZHDG」

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Dicing process using blades

https://technology.discousa.co

Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is ...

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Dicing Thin Wafers

https://www.disco.co.jp

Grit size, feed speed, and spindle speed are closely interrelated processing factors that require knowledge and experience to adjust. DISCO performs careful ...

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Disco NBC

https://www.equipx.net

DISCO's original blade development. These blades employ electroformed ... Grit size. #4500. #2000. #1200. #600. #320. Compound. Semiconductor Wafers. LiNbO3 ...

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NBC-Z

https://www.disco.co.jp

Deep cutting and grooving are possible using ultra-thin blades. Blade thickness - 0.015 mm to 0.3 mm; Wide range of grit sizes and bond types are available to ...

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NBC-ZH

https://www.aurotech.com

Wide range of grit sizes and bond types to support various application requirements; Easy to handle ultra-thin blades; Shorter blade change time for increased ...

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ZH05 SERIES

http://www.dhk.co.kr

5 grit concentration levels support diverse applications. Higher blade strength reduces wavy cutting and blade breakage. The ZH05 Series offers shorter precut ...

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