P1A

P1A

Providesprecisecontrolofdiamondconcentrationtoachieveoptimalcuttingquality.ProcessingData.Comparisonofcuttingefficiencyforbondtypes.。其他文章還包含有:「(HLFA」、「BladeDicing」、「Dicingprocessusingblades」、「DISCODIAMONDBLADEDICINGSAWBLADEKNS...」、「NBC-ZH」、「R07」、「Z05」、「ZH05」

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晶圓切割的方法與介紹blade dicing中文Dicing bladedisco切割刀切割刀集中度dicing saw中文DISCO diamond BladeDicing sawDISCO Blade grit size晶圓切割刀disco切割機
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(HLFA
(HLFA

https://www.ruten.com.tw

直購價: 3000 - 3000, 已賣數量: 2, 庫存: 1, 物品狀況: 全新,物品所在地: 台灣.高雄市, 價格更新時間:, 上架時間: 2021-05-30, 分類: 生活居家> 家居主材> 五金/工具> ...

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Blade Dicing
Blade Dicing

https://www.disco.co.jp

DISCO handles potentially harmful particles and debris with a variety of machine features and applications. Applications Example. Thick Wafer Dicing Using Blade ...

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Dicing process using blades
Dicing process using blades

https://technology.discousa.co

Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is ...

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DISCO DIAMOND BLADE DICING SAW BLADE KNS ...
DISCO DIAMOND BLADE DICING SAW BLADE KNS ...

https://www.ebay.com

DISCO NBC-ZH 105F-SE DIAMOND BLADE DICING SAW BLADE ADT KNS SILICON CUTTING NBC Look at the pictures for condition. After looking at the pictures please ...

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NBC-ZH
NBC-ZH

https://www.disco.co.jp

A combination of an ultrathin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results.

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R07
R07

https://www.disco.co.jp

樹脂結合劑切割刀片R07系列是根據加工材料的特性而開發的結合劑。新開發的結合劑能夠對應各種需求,並兼顧高品質與高速的加工。 實現硬脆材料的高品質加工 ...

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Z05
Z05

https://www.disco.co.jp

Offers excellent cutting performance for a wide range of applications from processing of hard and brittle materials to substrate dicing.

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ZH05
ZH05

https://www.disco.co.jp

運用新開發的集中度控制技術,開發出5個等級的集中度系列產品。透過集中度的細分化,您可使用到兼具了加工品質(特别是背面崩缺)和使用壽命的新型切割刀片。