DISCO diamond Blade:Dicing process using blades
Dicing process using blades
(HLFA
https://www.ruten.com.tw
直購價: 3000 - 3000, 已賣數量: 2, 庫存: 1, 物品狀況: 全新,物品所在地: 台灣.高雄市, 價格更新時間:, 上架時間: 2021-05-30, 分類: 生活居家> 家居主材> 五金/工具> ...
Blade Dicing
https://www.disco.co.jp
DISCO handles potentially harmful particles and debris with a variety of machine features and applications. Applications Example. Thick Wafer Dicing Using Blade ...
DISCO DIAMOND BLADE DICING SAW BLADE KNS ...
https://www.ebay.com
DISCO NBC-ZH 105F-SE DIAMOND BLADE DICING SAW BLADE ADT KNS SILICON CUTTING NBC Look at the pictures for condition. After looking at the pictures please ...
NBC-ZH
https://www.disco.co.jp
A combination of an ultrathin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results.
P1A
https://www.disco.co.jp
Provides precise control of diamond concentration to achieve optimal cutting quality. Processing Data. Comparison of cutting efficiency for bond types.
R07
https://www.disco.co.jp
樹脂結合劑切割刀片R07系列是根據加工材料的特性而開發的結合劑。新開發的結合劑能夠對應各種需求,並兼顧高品質與高速的加工。 實現硬脆材料的高品質加工 ...
Z05
https://www.disco.co.jp
Offers excellent cutting performance for a wide range of applications from processing of hard and brittle materials to substrate dicing.
ZH05
https://www.disco.co.jp
運用新開發的集中度控制技術,開發出5個等級的集中度系列產品。透過集中度的細分化,您可使用到兼具了加工品質(特别是背面崩缺)和使用壽命的新型切割刀片。