HBM3 spec:受AI加速晶片帶動HBM3與HBM3e將成明年市場主流
受AI加速晶片帶動HBM3與HBM3e將成明年市場主流
HBM3 Icebolt
https://semiconductor.samsung.
The HBM3 Icebolt takes performance to a whole new level, with processing speeds up to 6.4Gbps and bandwidth that reaches 819GB/s.
HBM3 Icebolt | DRAM
https://semiconductor.samsung.
HBM3 Icebolt 采用12 层10 纳米级16 Gb DRAM die堆叠,实现24GB 的存储容量,24GB是三星前代产品HBM2E的1.5 倍。利用新型解决方案打造更强大的神经网络,并以更快的速度处理 ...
HBM3E
https://tw.micron.com
HBM3E 提供16 個獨立通道和32 個虛擬通道。 美光的HBM3E 以領先業界的頻寬(每個位置超過1.2 TB/s),提供大於9.2Gbps 的針腳傳輸速度。 美光的HBM3E 使用8 層堆疊技術提供24GB 容量,使用12 層堆疊技術提供36GB 容量。 美光的HBM3E 功耗比競爭對手低30%。
hbm3e
https://www.micron.com
HBM is the most energy efficient memory technology to address AI needs, as measured by picojoules (pJ) per bit. Specifications. Micron HBM3E. Capacity. 24GB, ...
HBM3E
https://www.rambus.com
Operating at 6.4 Gigabits per Second (Gb/s), HBM3 can deliver a bandwidth of 819 Gigabytes per Second (GB/s), with HBM3E offering an extended ...
HIGH BANDWIDTH MEMORY (HBM3) DRAM
https://www.jedec.org
The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at ...
What Designers Need to Know About HBM3
https://www.synopsys.com
The HBM3 standard has a top speed of 6.4 Gbps, which is almost double the top speed of HBM2E at 3.6 Gbps.
What is High Bandwidth Memory 3 (HBM3)?
https://www.synopsys.com
The HBM3 standard enables devices with up to 32 Gb of density and up to 16-high stack for a total of 64 GB storage, nearly a 3x growth compared to HBM2E. With ...
高頻寬記憶體
https://zh.wikipedia.org
HBM3. 編輯. 第三代高頻寬記憶體(HBM3)於2016年正式發布,此代標準擴大了主記憶體容量、提升了主記憶體頻寬(512GB/s或更高)並降低了電壓與價格。人們猜測 ...