Polybenzoxazole (PBO)：Zylon
Zylon
Itisusedasshroudsandstays.ThePBO(polybenzoxazole)fiberisdegradedbyUVlight,seawater,andchafing(theproblemthatcausedZylontoberemoved ...。其他文章還包含有：「basedpolymersderivedfromthermalrearrangement(TR)...」、「Polybenzoxazole(PBO)」、「Polybenzoxazoles(PBO)」、「Polyimides(PI)&Polybenzoxazoles(PBO)」、「PolyimidesandPBO's」、「工程塑料」、「感光性高分子在先進構裝之應用與發展趨勢(上)」、...
查看更多 離開網站ChemicalcompoundZylon(IUPACname:poly(p-phenylene-2,6-benzobisoxazole))isatrademarkednameforarangeofthermosetliquid-crystallinepolyoxazole.ThissyntheticpolymermaterialwasinventedanddevelopedbySRIInternationalinthe1980sandmanufacturedbyToyobo.[2]Ingenericusage,thefiberisreferredtoasPBO.[3]Zylonhas5.8GPaoftensilestrength,[4]whichis1.6timesthatofKevlar.Additionally,ZylonhasahighYoungsmodulusof270GPa,meaningthatitisstifferthansteel.LikeKevlar,Zylonisusedinanumberofapplicationsthatrequireveryhighs...
based polymers derived from thermal rearrangement (TR) ...
https://pubs.rsc.org
Polybenzoxazoles (PBOs), such as thermally rearranged (TR) polymers, have been shown to have excellent gas separation performance.
Polybenzoxazole (PBO)
https://research.monash.edu
Polybenzoxazole (PBO)-based gas separation membranes thermally derived from blends of Ortho-functional polyimide and polyamide precursors.
Polybenzoxazoles (PBO)
https://polymerdatabase.com
Polybenzoxazoles (PBO) are a novel class of extremely heat-resistant thermoplastics with a benzene-fused oxazole ring structure.
Polyimides (PI) & Polybenzoxazoles (PBO)
https://waferdies.com
Polyimide (PI) and Polybenzoxazole (PBO) products are typically used as a stress relief and protective insulating layer before packaging or ...
Polyimides and PBO's
https://www.fujifilm.com
Polyimide and Polybenzoxazole (PBO) products are specialty stress relief coatings used as a protective layer or buffer coat before packaging or redistribution ...
工程塑料
https://zh.wikipedia.org
聚醚醚酮（Polyether ether ketone, PEEK）. 聚苯醚(Polyphenylene oxide, PPO). 聚苯硫醚(Polyphenylene Sulfide ,PPS). 聚苯並噁唑(Polybenzoxazole， PBO).
感光性高分子在先進構裝之應用與發展趨勢(上)
https://www.materialsnet.com.t
因此可承受高溫製程的高性能高分子，如Polyimide(PI)、Polybenzoxazole( PBO )、Benzocyclobutene( BCB )等在晶片或晶圓級封裝材( Wafer Level ...
晶圓級產品表面的聚苯噁唑裂痕之研究
https://ndltd.ncl.edu.tw
This object of this thesis is to investigate the dependence of backing condition on Polybenzoxazole (PBO) surface cracks of WLCSP products in the photo- ...