Underfill plasma：Underfill(底部填充劑)的目的與操作程序
Underfill(底部填充劑)的目的與操作程序
2011年4月11日—底部填充劑(Underfill)原本是設計給覆晶晶片(FlipChip)使用以強化其焊點的機械強度並增強其信賴度用的製程與膠水。因為矽材料做成的覆晶晶片的 ...。其他文章還包含有：「Effectofplasmaandstagingtimeontheunderfillvoidsin...」、「Effectofplasmatreatmentonadhesioncharacteristicsat...」、「Kronos」、「PlasmaCleaningpriortoFlipChipUnderfill」、「PlasmaforUnderfillProcessinFlipChipPackaging」、「...
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Effect of plasma and staging time on the underfill voids in ...
https://ieeexplore.ieee.org
Plasma cleaning of both substrate was done for 1 minute. Before underfill dispensing, staging of units was performed for 4, 6 and 8 hours, ...
Effect of plasma treatment on adhesion characteristics at ...
https://www.sciencedirect.com
The adhesion strengths of the underfills/FR-4 substrate and underfills/copper substrate are also studied. As experimental results, the plasma treatments of ...
Kronos
https://www.plasmarugged.com
Plasma Ruggedized Solutions has recently developed Kronos-10™, a state-of-the-art underfill material designed to protect the internal operational features ...
Plasma Cleaning prior to Flip Chip Underfill
https://www.pvateplaamerica.co
PVA TePla's microwave plasma consistently performs, providing void-free FlipChip underfill, optimum adhesion and a dramatically enhanced wicking speeds.
Plasma for Underfill Process in Flip Chip Packaging
https://www.circuitnet.com
Plasma treatment prior to the underfill process brings many benefits to the underfill dispensing process, such as it increases wicking speed, improves fillet ...
真空壓力烤箱來了徹底消滅Underfill Void 底部填充膠
https://www.istgroup.com
想確認先進封裝、IC晶片壽命與效能，卻因Underfill製程品質不佳，Void過多導致可靠度壽命預估失準?宜特可靠度測試實驗室，引進真空壓力烤箱， ...