Dicing tape：D Series 紫外線硬化型切割膠帶

D Series 紫外線硬化型切割膠帶

各製程之膠帶用途.AdwillDSeries可因應作業製程而改變特性的劃時代紫外線硬化型切割膠帶(UVCurableDicingTape)。。其他文章還包含有：「DicingTape」、「Dicingtape」、「DicingTape」、「DicingTapeLine」、「DicingTapes」、「UVDICINGTAPE」、「何謂DAF(DieAttachFilm)?晶圓切割膠帶(Dicingtape)?」、「晶圓切割膠帶(UVDicingTape)」

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Dicing Tape

https://www.linteceurope.com

Two types of dicing tape are available: UV curable type, “D series,” which achieves easier pick-up after reducing adhesion by UV irradiation, ...

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Dicing tape

https://en.wikipedia.org

Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or ...

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Dicing Tape

https://www.applichem.com.tw

有易撿晶的功能，可有效達到高精密薄型晶片製造生產。 -伸長率均勻. -可擴展性高. -減少 ...

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Dicing Tape Line

https://www.nitto.com

Dicing Tape Line-up ELEP HOLDER™. Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

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Dicing Tapes

http://www.npmt.com.tw

We perform a lineup of six types of Dicing Tape. Please check the following and get further information about UV tape, dicing saw, dicing blade, dicing table.

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