Dicing tape
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「Dicing tape」文章包含有:「DSeries紫外線硬化型切割膠帶」、「DicingTape」、「Dicingtape」、「DicingTape」、「DicingTapeLine」、「DicingTapes」、「UVDICINGTAPE」、「何謂DAF(DieAttachFilm)?晶圓切割膠帶(Dicingtape)?」、「晶圓切割膠帶(UVDicingTape)」
查看更多D Series 紫外線硬化型切割膠帶
https://www.lintec.com.tw
各製程之膠帶用途. Adwill D Series可因應作業製程而改變特性的劃時代紫外線硬化型切割膠帶(UV Curable Dicing Tape)。
Dicing Tape
https://www.linteceurope.com
Two types of dicing tape are available: UV curable type, “D series,” which achieves easier pick-up after reducing adhesion by UV irradiation, ...
Dicing tape
https://en.wikipedia.org
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or ...
Dicing Tape
https://www.applichem.com.tw
有易撿晶的功能,可有效達到高精密薄型晶片製造生產。 -伸長率均勻. -可擴展性高. -減少 ...
Dicing Tape Line
https://www.nitto.com
Dicing Tape Line-up ELEP HOLDER™. Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.
Dicing Tapes
http://www.npmt.com.tw
We perform a lineup of six types of Dicing Tape. Please check the following and get further information about UV tape, dicing saw, dicing blade, dicing table.
UV DICING TAPE
https://www.toyo-adtec.com.tw
Suitable for silicon wafer、LED、BGA、QFN、ceramic、glass cutting. Dicing Tape (UV Type). Item, Backing, Color, Base
何謂DAF(Die Attach Film)? 晶圓切割膠帶(Dicing tape)?
http://www.film-top1.com
DAF (Die Attach Film)為晶片黏結薄膜,用途是在雷射切割時,晶片可一起切割與分離,進行剝離(擴膜),使切割完後的晶片,都還可黏著在薄膜上,不會因切割而造成散亂排列。
晶圓切割膠帶(UV Dicing Tape)
https://www.everisland.com
延展效果佳,適用於擴膜產品。 防止Chip殘膠。 減少Chip切割背崩不良。 解UV效果優良,提高Pickup效率。