Fan-out Chip on Substrate：FOCoS
FOCoS
2.5D vs Fan
https://ase.aseglobal.com
2.5D IC, chip-first FOCoS and chip-last FOCoS have similar thermal performance and all of them are good enough for high power applications. More ...
ASE announces FOCoS advancements under the VIPack ...
https://www.aseglobal.com
(NYSE: ASX, TAIEX: 3711), announced today the industry's first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated ...
Fan
https://ase.aseglobal.com
Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os.
Fan
https://ase.aseglobal.com
Fan-Out re-distribution layers (RDL) can be an advanced substrate to break through the constrain so that RDL platform will be the core technology to evolve SiP ...
Wafer Warpage Experiments and Simulation for Fan
https://ieeexplore.ieee.org
Abstract: Fan-out chip on substrate (FOCoS) is defined as the fan-out package flip-chip mounts on high pin counts ball grid array substrate.
日月光VIPack 平台首創FOCoS 扇出型基板晶片封裝技術
https://technews.tw
半導體封測龍頭日月光半導體今日宣布，日月光VIPack 平台系列業界首創的FOCoS (Fan Out Chip on Substrate) 扇出型基板晶片封裝技術，當中主要分 ...