Fan-out Chip on Substrate：Wafer Warpage Experiments and Simulation for Fan

2.5D vs Fan

https://ase.aseglobal.com

2.5D IC, chip-first FOCoS and chip-last FOCoS have similar thermal performance and all of them are good enough for high power applications. More ...

ASE announces FOCoS advancements under the VIPack ...

https://www.aseglobal.com

(NYSE: ASX, TAIEX: 3711), announced today the industry's first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated ...

Fan

https://ase.aseglobal.com

Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os.

Fan

https://ase.aseglobal.com

Fan-Out re-distribution layers (RDL) can be an advanced substrate to break through the constrain so that RDL platform will be the core technology to evolve SiP ...

FOCoS

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日月光VIPack 平台首創FOCoS 扇出型基板晶片封裝技術

https://technews.tw

半導體封測龍頭日月光半導體今日宣布，日月光VIPack 平台系列業界首創的FOCoS (Fan Out Chip on Substrate) 扇出型基板晶片封裝技術，當中主要分 ...