SPM Clean：濕式化學品在半導體製程中之應用

濕式化學品在半導體製程中之應用

(SPM,PiranhaClean,.CaroClean):.主要是在清除晶圓表面的有機物。利用硫酸及雙氧水生成的卡羅酸，其強.氧化性及脫水性可破壞有機物的碳氫鍵.。其他文章還包含有：「HowtheSPMCleanProcessisSupportedinaWetBench...」、「RCAclean製程」、「SPMPhotoresistStrippingandCleaning」、「最常使用之晶圓表面清潔步驟為濕式化學法(wetchemistry)」、「第一章緒論」、「辛耘知識分享家」

查看更多離開網站

Provide From Google

How the SPM Clean Process is Supported in a Wet Bench ...

https://www.modutek.com

The process utilizes a mixture of approximately 3 parts sulfuric acid to 1 part hydrogen peroxide which is highly effective at eliminating ...

Provide From Google

RCA clean 製程

http://www.gptc.com.tw

製程中最常使用的是HCl : H2O2 : H2O=1 : 1 : 6 體積比，在70℃下進行5~10分鐘的清洗。 SPM, 主要是清除晶圓表面有機物。利用硫酸及雙氧水生成的卡羅酸，其強氧化性及脫水性 ...

Provide From Google

SPM Photoresist Stripping and Cleaning

https://www.microtechprocess.c

Post-resist strip cleaning using SPM removes residual organic material, but does not remove polymeric material composed of fluorocarbons, additional wet ...

Provide From Google