Esec Die Bonder:Die Bonding

Die Bonding

Die Bonding

TheDieBonderEsec2100hSisthe3rdgenerationofthemostflexible300mmhighspeedplatform,capableofrunninganextensiverangeofepoxydieattach ...。其他文章還包含有:「DieAttach」、「Esec2009SSIE」、「Esec2100FChS」、「Esec2100hS」、「Esec2100SC」、「Esec2100sDadvancedi」、「SoftSolderDieBonding」

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Die Attach
Die Attach

https://www.besi.com

The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked ...

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Esec 2009 SSI E
Esec 2009 SSI E

https://www.besi.com

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are ...

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Esec 2100 FC hS
Esec 2100 FC hS

https://www.besi.com

The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC ...

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Esec 2100 hS
Esec 2100 hS

https://www.besi.com

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...

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Esec 2100 SC
Esec 2100 SC

https://www.besi.com

The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run ...

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Esec 2100 sD advanced i
Esec 2100 sD advanced i

https://www.besi.com

Intelligence in Accuracy · Device Height Sensor for extreme Z-Height Control · High Precision Bond Head with highly accurate Theta-axis · High accuracy closed loop ...

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Soft Solder Die Bonding
Soft Solder Die Bonding

https://www.besi.com

Besi Switzerland is a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market.