Esec Die Bonder：Esec 2100 hS
Esec 2100 hS
Die Attach
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The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked ...
Die Bonding
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The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Esec 2009 SSI E
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The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are ...
Esec 2100 FC hS
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The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC ...
Esec 2100 SC
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The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run ...
Esec 2100 sD advanced i
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Intelligence in Accuracy · Device Height Sensor for extreme Z-Height Control · High Precision Bond Head with highly accurate Theta-axis · High accuracy closed loop ...
Soft Solder Die Bonding
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Besi Switzerland is a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market.