Dicing tape material:Dicing tape
Dicing tape
Dicing Tape
https://academic-accelerator.c
Dicing tape is made of a PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases, the dicing ...
Dicing Tape
https://www.linteceurope.com
This dicing tape is essential for full-cut dicing of wafers to improve die ... Base Material: PVC, PO, - High Expandability - Anti-chipping - Easy Pick Up
Dicing Tape Line
https://www.nitto.com
Dicing Tape Line-up ELEP HOLDER™. Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.
Semiconductor Wafer Processing Tape SWT 10+R
https://www.nitto.com
Nitto Semiconductor Wafer Tape SWT 10+R is designed for semiconductor dicing processes. This product consists of a blue transparent PVC film coated with a ...
Semiconductor Wafer Processing Tape SWT 10T+R
https://www.nitto.com
Nitto Semiconductor Wafer Tape SWT 10T+R is designed for semiconductor dicing processes. This product consists of a clear transparent PVC film coated with a ...
Standard Dicing Tape
https://www.semicorp.com
Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear ...
UV Curable Dicing Tape
https://www.adwill-global.com
Si Wafer (Base Material: PVC, PO) · High Expandability · Anti-chipping · Easy Pick Up · Antistatic · High Adhesion ...
Wafer Dicing Tapes
https://www.aitechnology.com
Wafer Dicing Tapes · Release-on-demand by exposure to UV irradiation to enable pick up of largest of dies. · Low ionic impurities and doesn't impart contamination ...
何謂DAF(Die Attach Film)? 晶圓切割膠帶(Dicing tape)?
http://www.film-top1.com
DAF (Die Attach Film)為晶片黏結薄膜,用途是在雷射切割時,晶片可一起切割與分離,進行剝離(擴膜),使切割完後的晶片,都還可黏著在薄膜上,不會因切割而造成散亂排列。