Dicing tape material

Dicing Tape

https://academic-accelerator.c

Dicing tape is made of a PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases, the dicing ...

Dicing Tape

https://www.linteceurope.com

This dicing tape is essential for full-cut dicing of wafers to improve die ... Base Material: PVC, PO, - High Expandability - Anti-chipping - Easy Pick Up

Dicing tape

https://en.wikipedia.org

Dicing Tape Line

https://www.nitto.com

Dicing Tape Line-up ELEP HOLDER™. Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Semiconductor Wafer Processing Tape SWT 10+R

https://www.nitto.com

Nitto Semiconductor Wafer Tape SWT 10+R is designed for semiconductor dicing processes. This product consists of a blue transparent PVC film coated with a ...

Semiconductor Wafer Processing Tape SWT 10T+R

https://www.nitto.com

Nitto Semiconductor Wafer Tape SWT 10T+R is designed for semiconductor dicing processes. This product consists of a clear transparent PVC film coated with a ...

Standard Dicing Tape

https://www.semicorp.com

Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear ...

UV Curable Dicing Tape

https://www.adwill-global.com

Si Wafer (Base Material: PVC, PO) · High Expandability · Anti-chipping · Easy Pick Up · Antistatic · High Adhesion ...

Wafer Dicing Tapes

https://www.aitechnology.com

Wafer Dicing Tapes · Release-on-demand by exposure to UV irradiation to enable pick up of largest of dies. · Low ionic impurities and doesn't impart contamination ...

何謂DAF(Die Attach Film)? 晶圓切割膠帶(Dicing tape)?

http://www.film-top1.com

DAF (Die Attach Film)為晶片黏結薄膜，用途是在雷射切割時，晶片可一起切割與分離，進行剝離(擴膜)，使切割完後的晶片，都還可黏著在薄膜上，不會因切割而造成散亂排列。