Fan-out Chip on Substrate Bridge：日月光搶AI商機推FOCoS
日月光搶AI商機推FOCoS
FOCoS
https://ase.aseglobal.com
日月光整合多顆ASIC封裝解決方案加速人工智能創新
https://money.udn.com
日月光半導體今（1）日宣佈，Fan-Out-Chip-on-Substrate-Bridge（FOCoS-Bridge）...
FOCoS
https://ase.aseglobal.com
Finally, the fan-out package was attached to an organic substrate using conventional flip chip process (see Fig. D). Benefits of FOCoS-Bridge.
日月光推出FOCoS
https://finance.ettoday.net
日月光半導體（3711）宣佈Fan-Out-Chip-on-Substrate-Bridge(FOCoS-Bridge)實現最新突破的技術，在70mm x 78mm尺寸的大型高效能封裝體中透過8個橋接 ...
ASE VIPack™ FOCoS
https://www.aseglobal.com
FOCoS-Bridge establishes the foundation for embedding passives and active chips in the fan-out package and provides options of decoupling ...
Fan
https://www.edn.com
ASE has developed a 70×78-mm Fan-Out Chip on Substrate Bridge (FOCoS-Bridge) package that packs two ASICs and eight high-bandwidth memory ...
加速AI創新日月光FOCoS
https://www.moneydj.com
旨在實現高度可擴展性，在無縫集成到複雜的晶片架構中，同時提供高密度晶片對晶片連接(D2D)、高I/O數量和高速信號傳輸，以滿足不斷發展的AI和HPC需求。