Fan-out Chip on Substrate Bridge：ASE VIPack™ FOCoS

FOCoS

https://ase.aseglobal.com

日月光整合多顆ASIC封裝解決方案加速人工智能創新

https://money.udn.com

日月光半導體今（1）日宣佈，Fan-Out-Chip-on-Substrate-Bridge（FOCoS-Bridge）...

FOCoS

https://ase.aseglobal.com

Finally, the fan-out package was attached to an organic substrate using conventional flip chip process (see Fig. D). Benefits of FOCoS-Bridge.

日月光推出FOCoS

https://finance.ettoday.net

日月光半導體（3711）宣佈Fan-Out-Chip-on-Substrate-Bridge(FOCoS-Bridge)實現最新突破的技術，在70mm x 78mm尺寸的大型高效能封裝體中透過8個橋接 ...

日月光搶AI商機推FOCoS

https://www.sinotrade.com.tw

... Fan-Out-Chip-on-Substrate-Bridge(FOCoS-Bridge) 實現最新突破的技術，在70mm x 78mm 尺寸的大型高效能. 日月光投控(3711-TW)(ASX-US) 旗下日月光今(1) ...

Fan

https://www.edn.com

ASE has developed a 70×78-mm Fan-Out Chip on Substrate Bridge (FOCoS-Bridge) package that packs two ASICs and eight high-bandwidth memory ...

加速AI創新日月光FOCoS

https://www.moneydj.com

旨在實現高度可擴展性，在無縫集成到複雜的晶片架構中，同時提供高密度晶片對晶片連接(D2D)、高I/O數量和高速信號傳輸，以滿足不斷發展的AI和HPC需求。