Integrated fan-out：Fan

Fan-Out packaging continues to gain prominence within the industry, based on significant technical advantages that have led to its broad commercialization. As we move further into the era of system-in-package (SIP) and heterogeneous integration, Fan-Out packaging will become increasingly significant. ASE is evolving this advanced packaging platform to meet application demands for smaller form factors and improved electrical and thermal performance.

What is Fan-Out Packaging?

Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very ...