Integrated fan-out：整合型扇出晶圓級封裝技術實現28 GHz低雜訊放大器應用於 ...

整合型扇出晶圓級封裝技術實現28 GHz低雜訊放大器應用於 ...

由彭昇楷著作·2018—Inthisthesis,weproposedaradiofrequencylow-noiseamplifier(LNA)implementedinIntegratedFan-Out(InFO)wafer-levelpackaging(WLP)technology.The ...。其他文章還包含有：「Fan」、「Fan」、「High」、「InFO(IntegratedFan」、「InFO(IntegratedFan」、「InFO(WaferLevelIntegratedFan」、「先进封装技术科普：什么是扇出型封装Fan」、「集成扇出型封裝（InFO）技術是什麼?」、「電子封裝技術最新發展狀況」

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Fan

https://ase.aseglobal.com

Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional ...

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Fan

https://en.wikipedia.org

Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. Fan-out ...

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High

https://ieeexplore.ieee.org

Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) ...

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InFO (Integrated Fan

https://www.tsmc.com

InFO is an innovative wafer level system integration technology platform, featuring high density RDL (Re-Distribution Layer) and TIV (Through InFO Via) for ...

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InFO (Integrated Fan

https://3dfabric.tsmc.com

InFO is an innovative wafer level system integration technology platform, featuring high density RDL (Re-Distribution Layer) and TIV (Through InFO Via) for ...

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InFO (Wafer Level Integrated Fan

https://ieeexplore.ieee.org

A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application processor chip with memory ...

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