DISCO wafer Grinding：DISCO grinding and polishing machines ...
DISCO grinding and polishing machines ...
DFG8540
https://www.disco.co.jp
Wafer Thinning. Thin grinding (100 µm). Advanced handling systems and design features facilitate high yield for thin wafer grinding. Design flexibility. The ...
DFG8540
https://www.disco.co.jp
Grinding Method, -, Anomalous In-feed grinding with wafer rotation. Grinding Wheels, -, Φ200 mm Diamond Wheel. Spindle, Rated output, kW, 4.2. Rotation speed ...
Grinding
https://www.disco.co.jp
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.
TAIKO Process
https://www.disco.co.jp
The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO ...
Thinning by grinding wheel
https://technology.discousa.co
The wafers are ground on the backside of the semiconductor circuit pattern, hence the name “back grinding” (BG) for this process. When processing down to a ...
Ultra
https://www.disco.co.jp
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.
研磨
https://www.disco.co.jp
High quality sapphire processing · Reducing wafer edge chipping by optimizing the fine grinding amount · Improving TTV by Planarization of backgrinding (BG) tape ...