DISCO wafer Grinding:DISCO grinding and polishing machines ...

DISCO grinding and polishing machines ...

DISCO grinding and polishing machines ...

...DISCOgrinderandpolisheravailableforDGS.Buyhighqualitygrinding/polishingequipment....Grinding/PolishingMachines.WaferGrinderandWaferPolisher.。其他文章還包含有:「DFG8540」、「DFG8540」、「Grinding」、「TAIKOProcess」、「Thinningbygrindingwheel」、「Ultra」、「研磨」

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DFG8540
DFG8540

https://www.disco.co.jp

Wafer Thinning. Thin grinding (100 µm). Advanced handling systems and design features facilitate high yield for thin wafer grinding. Design flexibility. The ...

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DFG8540
DFG8540

https://www.disco.co.jp

Grinding Method, -, Anomalous In-feed grinding with wafer rotation. Grinding Wheels, -, Φ200 mm Diamond Wheel. Spindle, Rated output, kW, 4.2. Rotation speed ...

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Grinding
Grinding

https://www.disco.co.jp

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.

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TAIKO Process
TAIKO Process

https://www.disco.co.jp

The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO ...

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Thinning by grinding wheel
Thinning by grinding wheel

https://technology.discousa.co

The wafers are ground on the backside of the semiconductor circuit pattern, hence the name “back grinding” (BG) for this process. When processing down to a ...

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Ultra
Ultra

https://www.disco.co.jp

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.

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研磨
研磨

https://www.disco.co.jp

High quality sapphire processing · Reducing wafer edge chipping by optimizing the fine grinding amount · Improving TTV by Planarization of backgrinding (BG) tape ...