DISCO grinding
「DISCO grinding」熱門搜尋資訊
![DISCO grinding](https://i0.wp.com/api.multiavatar.com/DISCO+grinding.png?apikey=viVnb6N20jclO8)
「DISCO grinding」文章包含有:「DFG8540|Grinders」、「DFG8540」、「DFG8830」、「Grinding」、「Poligrind」、「TAIKOProcess|Grinding」、「Ultra-ThinGrinding|Grinding」、「研磨」
查看更多![DFG8540 | Grinders](https://api.multiavatar.com/DFG8540+%7C+Grinders+%7C+Product+Information+-+DISCO+Corporation.png?apikey=viVnb6N20jclO8)
DFG8540 | Grinders
https://www.disco.co.jp
Supports advancements for thinner wafers · Thin grinding (100 µm). Advanced handling systems and design features facilitate high yield for thin wafer grinding.
![DFG8540](https://api.multiavatar.com/DFG8540+%7C+%E7%A0%94%E7%A3%A8%E6%A9%9F%7C+%E7%94%A2%E5%93%81%E4%BB%8B%E7%B4%B9.png?apikey=viVnb6N20jclO8)
DFG8540
https://www.disco.co.jp
Specifications ; Grinding Wheels, -, Φ200 mm Diamond Wheel ; Spindle, Rated output, kW, 4.2.
![DFG8830](https://api.multiavatar.com/DFG8830+%7C+%E7%A0%94%E7%A3%A8%E6%A9%9F%7C+%E7%94%A2%E5%93%81%E4%BB%8B%E7%B4%B9.png?apikey=viVnb6N20jclO8)
DFG8830
https://www.disco.co.jp
Grinding method, -, In-feed grinding with wafer rotation. Grinding wheel, -, Φ300 mm Diamond Wheel. Spindle, Rated output, kW, 6.3.
![Grinding](https://api.multiavatar.com/Grinding+%7C+Solutions+%7C+DISCO+Corporation.png?apikey=viVnb6N20jclO8)
Grinding
https://www.disco.co.jp
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.
![Poligrind](https://api.multiavatar.com/Poligrind+%7C+%E7%A0%94%E7%A3%A8%E8%BC%AA%7C+%E7%94%A2%E5%93%81%E4%BB%8B%E7%B4%B9.png?apikey=viVnb6N20jclO8)
Poligrind
https://www.disco.co.jp
PoligrindGrinding Wheels. 列印print ... 由第三方對敝司刀片進行刀刃再生處理的聲明 · What kind of company is DISCO? © 2020 DISCO Corporation. All rights reserved.
![TAIKO Process | Grinding](https://api.multiavatar.com/TAIKO+Process+%7C+Grinding+%7C+Solutions+-+DISCO+Corporation.png?apikey=viVnb6N20jclO8)
TAIKO Process | Grinding
https://www.disco.co.jp
When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner ...
![Ultra-Thin Grinding | Grinding](https://api.multiavatar.com/Ultra-Thin+Grinding+%7C+Grinding+%7C+Solutions+-+DISCO+Corporation.png?apikey=viVnb6N20jclO8)
Ultra-Thin Grinding | Grinding
https://www.disco.co.jp
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.
![研磨](https://api.multiavatar.com/%E7%A0%94%E7%A3%A8%7C+%E8%A7%A3%E6%B1%BA%E6%96%B9%E6%A1%88+-+DISCO+Corporation.png?apikey=viVnb6N20jclO8)
研磨
https://www.disco.co.jp
High quality sapphire processing · Reducing wafer edge chipping by optimizing the fine grinding amount · Improving TTV by Planarization of backgrinding (BG) tape ...